- All
- Product Name
- Product Keyword
- Product Model
- Product Summary
- Product Description
- Multi Field Search
 |
| Quantity: | |
|---|---|
Siplace TX2IW
ASM
TX2IW
| Machine type | SIPLACE TX2i | SIPLACE TX2 | SIPLACE TX1 |
| Placement speed (benchmark rating) | Up to 96,000 cph | Up to 85,500 cph | Up to 44,000 cp |
| Machine dimensions (L × W × H) | 1.00 m × 2.23 m × 1.45 m | 1.00 m × 2.47 m × 1.45 m | 1.00 m × 2.35 m × 1.45 m |
| Placement heads | Placement Head CP20, Placement Head CPP, Placement Head TH | ||
| Component spectrum | 0.12 mm x 0.12 mm to 200 mm × 110 mm** | ||
| PCB dimensions (L × W) | 50 mm × 45 mm to 590 mm* × 260 mm (dual lane) | ||
| 50 mm × 45 mm to 590 mm* × 460 mm (single lane mode) | |||
| Component feeding | up to 80 × 8 mm tape feeders, JEDEC trays, Linear Dipping Unit, Glue Feeder, Force Verification Feeder, SIPLACE Tray Unit | ||
| Typical power consumption | 2.0 kW (with vacuum pump) | ||
| 1.2 kW (without vacuum pump) | |||
| Compressed air consumption | 120 Nl/min (with vacuum pump) | 70 Nl/min (with vacuum pump) | |
| * With Long Board Option (without LBO, maximum PCB length 375 mm) | |||
| ** With restrictions | |||
| Placement heads | Placement Head CP20 | Placement Head CPP | Placement Head TWIN |
| Component spectrum | 0.12 mm x 0.12 mm | 01005 to 50 mm × 40 mm | 0201 to 200 mm × 110 mm |
| to 8.2 mm × 8.2 mm | |||
| Component height | 4 mm | 15.5 mm | 25 mm |
| Placement accuracy (3 σ) | 25 µm | 34 µm | 22 µm |
| Maximum speed | 48,000 cph | 25,500 cph | 5,500 cph |
| Placement force | 0.5 N to 4.5 N | 1.0 N to 15 N | 1.0 N to 30 N |
| Machine type | SIPLACE TX2i | SIPLACE TX2 | SIPLACE TX1 |
| Placement speed (benchmark rating) | Up to 96,000 cph | Up to 85,500 cph | Up to 44,000 cp |
| Machine dimensions (L × W × H) | 1.00 m × 2.23 m × 1.45 m | 1.00 m × 2.47 m × 1.45 m | 1.00 m × 2.35 m × 1.45 m |
| Placement heads | Placement Head CP20, Placement Head CPP, Placement Head TH | ||
| Component spectrum | 0.12 mm x 0.12 mm to 200 mm × 110 mm** | ||
| PCB dimensions (L × W) | 50 mm × 45 mm to 590 mm* × 260 mm (dual lane) | ||
| 50 mm × 45 mm to 590 mm* × 460 mm (single lane mode) | |||
| Component feeding | up to 80 × 8 mm tape feeders, JEDEC trays, Linear Dipping Unit, Glue Feeder, Force Verification Feeder, SIPLACE Tray Unit | ||
| Typical power consumption | 2.0 kW (with vacuum pump) | ||
| 1.2 kW (without vacuum pump) | |||
| Compressed air consumption | 120 Nl/min (with vacuum pump) | 70 Nl/min (with vacuum pump) | |
| * With Long Board Option (without LBO, maximum PCB length 375 mm) | |||
| ** With restrictions | |||
| Placement heads | Placement Head CP20 | Placement Head CPP | Placement Head TWIN |
| Component spectrum | 0.12 mm x 0.12 mm | 01005 to 50 mm × 40 mm | 0201 to 200 mm × 110 mm |
| to 8.2 mm × 8.2 mm | |||
| Component height | 4 mm | 15.5 mm | 25 mm |
| Placement accuracy (3 σ) | 25 µm | 34 µm | 22 µm |
| Maximum speed | 48,000 cph | 25,500 cph | 5,500 cph |
| Placement force | 0.5 N to 4.5 N | 1.0 N to 15 N | 1.0 N to 30 N |
